Vapor Etching and Decomposition Technology

Ingentec has successfully developed Vapor Etching and Decomposition technology and equipment and has obtained patents from many countries due to its expertise with specialty gases.

Technology Features

Vapor Etching and Decomposition

Exceptional Foundry Service

Combined with a specialized gas recipe to offer exceptional foundry services

Effectively Remove Films

Our dry etch process effectively removes films and drills via.

Reduce Material Costs

With extremely low chemical consumption, we align with ESG trends while helping to reduce our customer's wafer scrap rates and material costs.

Technology Application

Ingentec's Wafer ReBirth utilizes gaseous etching technology to remove the thin surface of silicon wafers. With the increasing complexity of the semiconductor manufacturing process, there has been a rise in the use of silicon wafers for testing and dummy purposes.

Wafer ReBirth

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Through Glass Via (TGV)

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About Through Glass Via (TGV)

Ingentec's specialized gaseous decomposition and dissolution equipment can create micro apertures in glass as small as 10 µm in diameter. This innovative technology is employed in the industrial drilling processes for micro LEDs, semiconductor 3-D packaging, MEMS, biotechnology, and 5G chips. Ingentec is dedicated to exploring and developing additional applications for this technology.

Service Item

TGV via drilling (capability: 10-30 um diameter)
TGV via drilling + metal filling

Application

Mini & Micro LED
Biotechnology IC
2.5D & 3D IC Package
MEMS
5G IC

About Wafer ReBirth

The Wafer ReBirth service utilizes cutting-edge technology to remove the film from the wafer surface, employing specialized gases and process tools developed by Ingentec.

What is Wafer ReBirth ?

A vapor etch machine, along with a specialized gas recipe for film removal from wafers, is utilized in a process known as "Wafer ReBirth ."

Fab Reclaim Process

Wafer ReBirth service is a state-of-art technology to eliminate the film on wafer surface by using specialty gas and process tools designed by Ingentec.

※Simple file：SiO2、Metal film

※Complex film：Nitride、Poly-Si、SiC、Carbon、Metal Silicide、Special Metals

ReBirth and Reclaim Process Comparison

In comparison to the traditional wet process for film stripping, the Wafer ReBirth uses only 1% of the amount of chemicals and allows for an increased number of repeated uses. This technology takes into account cost reduction, environmental protection, and energy saving, in line with ESG goals.